Curdlan–chitosan electrospun fibers as potential scaffolds for bone regeneration

dc.contributor.authorDube, A
dc.contributor.authorToullec, C
dc.contributor.authorBideau, J.L
dc.date.accessioned2021-05-20T12:26:57Z
dc.date.available2021-05-20T12:26:57Z
dc.date.issued2021
dc.description.abstractPolysaccharides have received a lot of attention in biomedical research for their high potential as scaffolds owing to their unique biological properties. Fibrillar scaffolds made of chitosan demonstrated high promise in tissue engineering, especially for skin. As far as bone regeneration is concerned, curdlan (1,3‐β‐glucan) is particularly interesting as it enhances bone growth by helping mesenchymal stem cell adhesion, by favoring their differentiation into osteoblasts and by limiting the osteoclastic activity. Therefore, we aim to combine both chitosan and curdlan polysaccharides in a new scaffold for bone regeneration. For that purpose, curdlan was electrospun as a blend with chitosan into a fibrillar scaffold. We show that this novel scaffold is biodegradable (8% at two weeks), exhibits a good swelling behavior (350%) and is non‐cytotoxic in vitro. In addition, the benefit of incorporating curdlan in the scaffold was demonstrated in a scratch assay that evidences the ability of curdlan to express its immunomodulatory properties by enhancing cell migration. Thus, these innovative electrospun curdlan–chitosan scaffolds show great potential for bone tissue engineering.en_US
dc.identifier.citationDube, A. et al. (2021). Curdlan–chitosan electrospun fibers as potential scaffolds for bone regeneration. Polymers, 13(4),526, 1-14en_US
dc.identifier.issn2073-4360
dc.identifier.uri10.3390/polym13040526
dc.identifier.urihttp://hdl.handle.net/10566/6179
dc.language.isoenen_US
dc.publisherMPDIen_US
dc.subjectChitosanen_US
dc.subjectCurdlanen_US
dc.subjectElectrospinningen_US
dc.subjectRegenerative medicineen_US
dc.subjectTissue engineeringen_US
dc.titleCurdlan–chitosan electrospun fibers as potential scaffolds for bone regenerationen_US
dc.typeArticleen_US

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